Chip on Board
Features of our chip on board processes:
- Wire bonding accuracy of ± 68 µm.
- The capacity of 3, 00,000 wires per day.
- Die bonding accuracy up to ± 100 µm.
- Both manual as well as semi-automatic die bonding facility.
- Can handling Chip on tray, conductive or nonconductive epoxy.
- Encapsulation accuracy up to ± 100 µm.
- Use of black or transparent epoxy.
- Housed in Class 10000 cleanroom ESD safe environment.