Manufacturing Capabilities

Manufacturing Capabilities

Our key manufacturing capabilities include :

Assembly

Through-Hole Insertion

Paste & Glue Bottom Side (SMD)

Hybrid assemblies

Conformal Coating – Spray & selective

Dispensing, encapsulation & potting

Cable and harness Assembly

Box Build, sub assembly and system build

General

  • High volume flash program
  • Labeling with traceability
  • Packaging development

Pick and Place

  • 0201,0402, and 0603
  • QFP, QFN, Leadless
  • BGA and Mini BGA

Testing

  • Electromechanical Assembly & Test
  • PCB Assembly and Test
  • Reliability Test and Burn in Test

Soldering

  • No clean wave and selective
  • Hand Soldering with process control

Rework

  • BGA Rework Station
  • High wattage rework

Screen Printing

  • Step Stencil & glue dispensing with IPAG
  • Lead Free with 2 1/2D inspection

Inspection

  • Automated Optical (AOI)
  • Stereo zoom microscopes
  • Profile Projector
  • X-Ray Inspection with cross-section analysis

Reflow

  • Long process length with chilled water cooling
  • Nitrogen-based SMD Reflow
  • Lead-Free with superior flux management

Depaneling

  • Router, V-Cut & Punch