PCB Assemblies
Our Capabilities include:
- Single and double-sided surface mount (SMT) assembly.
- Automated pin through-hole (PTH) assembly
- Ball grid array (BGA) and Micro BGA assembly supported with rework
- Chip scale package (CSP) and quad flat packages (QFP) assembly
- Passive discrete packages down to 0201
- Electromechanical assemblies & system integration
- Flex circuit assembly
- Wave soldering for ROHS and leaded components
- Aqueous and no-clean chemistries
- Conformal coating, encapsulation & potting
- Selective wave soldering options
- Test development for functional and In-circuit test
- Box build & electromechanical assemblies
- Final systems test
- Final Product Assembly (Box Build)
We use SAP R/3 resource planning software to organize and plan manufacturing workflow. Our engineering team works with customers to produce detailed plans and documentation to ensure the requirements are executed correctly and to specification .